JPH0365254U - - Google Patents

Info

Publication number
JPH0365254U
JPH0365254U JP12605889U JP12605889U JPH0365254U JP H0365254 U JPH0365254 U JP H0365254U JP 12605889 U JP12605889 U JP 12605889U JP 12605889 U JP12605889 U JP 12605889U JP H0365254 U JPH0365254 U JP H0365254U
Authority
JP
Japan
Prior art keywords
semiconductor device
circuit board
terminal
flat plate
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12605889U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0727639Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989126058U priority Critical patent/JPH0727639Y2/ja
Publication of JPH0365254U publication Critical patent/JPH0365254U/ja
Application granted granted Critical
Publication of JPH0727639Y2 publication Critical patent/JPH0727639Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1989126058U 1989-10-27 1989-10-27 半導体装置 Expired - Fee Related JPH0727639Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989126058U JPH0727639Y2 (ja) 1989-10-27 1989-10-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989126058U JPH0727639Y2 (ja) 1989-10-27 1989-10-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH0365254U true JPH0365254U (en]) 1991-06-25
JPH0727639Y2 JPH0727639Y2 (ja) 1995-06-21

Family

ID=31673897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989126058U Expired - Fee Related JPH0727639Y2 (ja) 1989-10-27 1989-10-27 半導体装置

Country Status (1)

Country Link
JP (1) JPH0727639Y2 (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165499A (ja) * 2004-06-08 2006-06-22 Fuji Electric Device Technology Co Ltd 半導体装置
DE102011085313B4 (de) * 2010-11-11 2020-12-24 Mitsubishi Electric Corporation Halbleitervorrichtung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01302753A (ja) * 1988-05-30 1989-12-06 Sansha Electric Mfg Co Ltd 樹脂封止型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01302753A (ja) * 1988-05-30 1989-12-06 Sansha Electric Mfg Co Ltd 樹脂封止型半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165499A (ja) * 2004-06-08 2006-06-22 Fuji Electric Device Technology Co Ltd 半導体装置
DE102011085313B4 (de) * 2010-11-11 2020-12-24 Mitsubishi Electric Corporation Halbleitervorrichtung

Also Published As

Publication number Publication date
JPH0727639Y2 (ja) 1995-06-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees