JPH0365254U - - Google Patents
Info
- Publication number
- JPH0365254U JPH0365254U JP12605889U JP12605889U JPH0365254U JP H0365254 U JPH0365254 U JP H0365254U JP 12605889 U JP12605889 U JP 12605889U JP 12605889 U JP12605889 U JP 12605889U JP H0365254 U JPH0365254 U JP H0365254U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- terminal
- flat plate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000006378 damage Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989126058U JPH0727639Y2 (ja) | 1989-10-27 | 1989-10-27 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989126058U JPH0727639Y2 (ja) | 1989-10-27 | 1989-10-27 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0365254U true JPH0365254U (en]) | 1991-06-25 |
JPH0727639Y2 JPH0727639Y2 (ja) | 1995-06-21 |
Family
ID=31673897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989126058U Expired - Fee Related JPH0727639Y2 (ja) | 1989-10-27 | 1989-10-27 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0727639Y2 (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006165499A (ja) * | 2004-06-08 | 2006-06-22 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
DE102011085313B4 (de) * | 2010-11-11 | 2020-12-24 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01302753A (ja) * | 1988-05-30 | 1989-12-06 | Sansha Electric Mfg Co Ltd | 樹脂封止型半導体装置 |
-
1989
- 1989-10-27 JP JP1989126058U patent/JPH0727639Y2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01302753A (ja) * | 1988-05-30 | 1989-12-06 | Sansha Electric Mfg Co Ltd | 樹脂封止型半導体装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006165499A (ja) * | 2004-06-08 | 2006-06-22 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
DE102011085313B4 (de) * | 2010-11-11 | 2020-12-24 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
Also Published As
Publication number | Publication date |
---|---|
JPH0727639Y2 (ja) | 1995-06-21 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |